Regulations last checked for updates: May 18, 2024

Title 40 - Protection of Environment last revised: May 16, 2024
All TitlesTitle 40Chapter IPart 98Subpart IAppendix - Table I-5 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
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Appendix - Table I-5 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing
Process type factors Process gas i
CF4 C2F6 CHF3 CH2F2 C3F8 c− C4F8 NF3
Remote 		NF3 SF6 C4F6a C5F8a C4F8Oa
Etch 1-Ui0.7 10.4 10.4 10.06NA 10.2NA0.20.20.10.2NA
Etch BCF4NA 10.4 10.07 10.08NA0.2NANANA 10.30.2NA
Etch BC2F6NANANANANA0.2NANANA 10.20.2NA
CVD Chamber Cleaning 1-Ui0.90.6NANA0.40.10.020.2NANA0.10.1
CVD Chamber Cleaning BCF4NA0.1NANA0.10.1 20.02 20.1NANA0.10.1
CVD Chamber Cleaning BC3F8NANANANANANANANANANANA0.4

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

1 Estimate includes multi-gas etch processes.

2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.

[75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]
authority: 42 U.S.C. 7401-7671q.
source: 74 FR 56374, Oct. 30, 2009, unless otherwise noted.
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