Regulations last checked for updates: May 18, 2024

Title 40 - Protection of Environment last revised: May 16, 2024
All TitlesTitle 40Chapter IPart 98Subpart IAppendix - Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
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Appendix - Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes
Link to an amendment published at 89 FR 31920, Apr. 25, 2024.

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type Process gas i
CF4 C2F6 CHF3 CH2F2 C2HF5 CH3F C3F8 C4F8 NF3 SF6 C4F6 C5F8 C4F8O
Etching/Wafer Cleaning
1-Ui0.810.720.510.130.0640.70NA0.140.190.550.170.072NA
BCF4NA0.100.0850.0790.077NANA0.110.00400.130.13NANA
BC2F60.046NA0.0300.0250.0240.0034NA0.0370.0250.110.110.014NA
BC4F6NANANANANANANANANANANANANA
BC4F8NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
BC5F80.0012NA0.0012NANANANA0.0086NANANANANA
BCHF30.100.047NA0.049NANANA0.040NA0.00120.0660.0039NA
Chamber Cleaning
In situ plasma cleaning:
1-Ui0.920.55NANANANA0.400.100.18NANANA0.14
BCF4NA0.21NANANANA0.200.110.050NANANA0.13
BC2F6NANANANANANANANANANANANA0.045
BC3F8NANANANANANANANANANANANANA
Remote plasma cleaning:
1-UiNANANANANANANANA0.017NANANANA
BCF4NANANANANANANANA0.015NANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA
In situ thermal cleaning:
1-UiNANANANANANANANANANANANANA
BCF4NANANANANANANANANANANANANA
BC2F6NANANANANANANANANANANANANA
BC3F8NANANANANANANANANANANANANA

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

[81 FR 9255, Dec. 9, 2016]
authority: 42 U.S.C. 7401-7671q.
source: 74 FR 56374, Oct. 30, 2009, unless otherwise noted.
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