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Regulations last checked for updates: May 18, 2024
Title 40 - Protection of Environment last revised: May 16, 2024
All Titles
Title 40
Chapter I
Part 98
Subpart I
Appendix - Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
View all text of [None - None]
Appendix - Table I-16 to Subpart I of Part 98—Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing
Link to an amendment published at 89 FR 31922, Apr. 25, 2024.
Manufacturing type/process type/gas
Default
DRE
(percent)
MEMS, LCDs, and PV Manufacturing
60
Semiconductor Manufacturing:
Plasma Etch/Wafer Clean Process Type:
CF
4
75
CH
3
F
97
CHF
3
97
CH
2
F
2
97
C
2
F
6
97
C
3
F
8
97
C
4
F
6
97
C
4
F
8
97
C
5
F
8
97
SF
6
97
NF
3
96
All other carbon-based plasma etch/wafer clean fluorinated GHG
60
Chamber Clean Process Type:
NF
3
88
All other chamber clean fluorinated GHG
60
N
2
O Processes:
CVD and all other N
2
O-using processes
60
[78 FR 68234, Nov. 13, 2013]
authority:
42 U.S.C. 7401-7671q.
source:
74 FR 56374, Oct. 30, 2009, unless otherwise noted.
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