CLA-2-84:RR:NC:1:103 A89183
Mr. Fred Ramos
Expeditors International Inc.
PO Box 610629
Dallas Fort Worth Airport, TX 75261-0629
RE: The tariff classification of an epoxy die bonding machine from Germany
Dear Mr. Ramos:
In your letter dated October 24, 1996 on behalf of Honeywell Microswitch
you requested a tariff classification ruling.
With your inquiry you submitted literature which describes the series 4500
epoxy die bonder. Epoxy die bonding is a process used in the semiconductor
industry to assemble a bare die or chip to a package which provides the contact
leads to the chip. The series 4500 epoxy die bonder will be used to mount
single or multiple die onto TO-18 or TO-46 header substrates for fiber optic
components. The machine will incorporate a pattern recognition system to
properly align the die prior to placement, an epoxy stamping and/or dispensing
station, a pick and place station capable of handling chips ranging in size from
.25 to 15 millimeters, and a programmable control system. The assembly process
performed by the machine will basically consist of positioning and securing the
header, depositing a controlled amount of epoxy onto the header, picking a die,
and placing the die onto the epoxy film location.
The applicable subheading for the series 4500 epoxy die bonder machine will
be 8479.89.8590, Harmonized Tariff Schedule of the United States (HTS), which
provides for other machines for production and assembly of diodes, transistors
and similar semiconductor devices and electronic integrated circuits. The rate
of duty will be free.
This ruling is being issued under the provisions of Part 177 of the Customs
Regulations (19 C.F.R. 177).
A copy of the ruling or the control number indicated above should be
provided with the entry documents filed at the time this merchandise is
imported. If you have any questions regarding the ruling, contact National
Import Specialist Alan Horowitz at 212-466-5494.
Sincerely,
Roger J. Silvestri
Director
National Commodity
Specialist Division